TSV fabrication

Lam Research: SABRE 3D

Lam Research: SABRE 3D

SABRE® 3D is a next-generation electroplating product designed to meet leading-edge production requirements for advanced packaging applications.  This product leverages proprietary front-end manufacturing technology and offers market-specific solutions for copper pillar and through-silicon via (TSV) fabrication.  SABRE 3D offers industry-leading throughput along with reduced cost of consumabl... »