Tin-Silver bump chemistry

Dow Electronic Materials: SOLDERON™ BP TS 6000 Tin-Silver Chemistry

Dow Electronic Materials: SOLDERON™ BP TS 6000 Tin-Silver Chemistry

SOLDERON™ BP TS 6000 Tin-Silver is a lead-free chemistry for solder bump applications. From a single formulation, it is capable of plating speeds of 2-9+ µm/min, tunable composition and the industry’s most robust process window. This flexibility makes it ideal for applications from C4 bumping to micro-Cu pillar capping. Testimonial In the latest 2.5D and 3D packaging schemes utilizing copper ... »