temporary bond and debond

Talking Nerdy with Exhibitors at IWLPC 2018

Talking Nerdy with Exhibitors at IWLPC 2018

With heterogeneous integration, 3D, and advanced wafer-level packaging technologies officially declared the rising stars of the semiconductor industry, materials, process and equipment suppliers have pulled out their shiniest bells and whistles. Here’s a sampling of news and products that were on display at IWLCP 2018, October 23-25, 2018 at the Doubletree Hotel in San Jose. Indium Corporationâ€... »

SUSS MicroTec Brings 3D IC Laser Debonding to Fraunhofer IZM

SUSS MicroTec Brings 3D IC Laser Debonding to Fraunhofer IZM

SUSS MicroTec announced the installation of its ELP300 excimer laser stepper to support next-generation advanced packaging and 3D IC laser debonding applications at the Fraunhofer Institute for Reliability and Microintegration (IZM), Berlin. The ELP300 excimer laser platform is designed for high volume manufacturing (HVM) and processing of 100mm to 300mm wafers. The platform provides two novel man... »

Things are humming along at EV Group

“Keeping busy” doesn’t begin to describe what’s happening at EV Group these days. I sat down with Markus Wimplinger, Corporate Technology Development and IP Director, EVG,  at SEMICON West for a full briefing of the company’s latest corporate and technology developments.  Remaining true to their mission of “invent, innovate, implement” gave us a lot to talk about. Technology Devel... »