stacked die

Omnivision: OV23850 PureCel Image Sensor

Omnivision: OV23850 PureCel Image Sensor

OmniVision’s OV23850 PureCel image sensor utilizes the companies advanced stacked die process capture exceptional images and video in 23.8-megapixel resolution while maintaining a compact form factor, which is critical for the next-generation of slim smartphones and tablets. Testimonial OmniVision’s family of PureCel backside-illuminated image sensors use the company’s stacked di... »

Prior Predictions

Every once in a while, it’s helpful to step back and get a broad view of what’s going on in the world of packaging as a whole to get a better idea of how much impact 3D has. In this morning’s opening keynote at the IMAPS Device Packaging Conference, Prismark Partners’ Brandon Prior did just that; offering a comprehensive snapshot of the 3D packaging landscape. »