sensors

Copyright: Nino Halm (Photographer)

The Fraunhofer Cluster for 3D Integration Looks at the Big Picture

Two years ago, I visited to Fraunhofer IZM-ASSID, located in Dresden, Germany; to see first-hand what this particular arm of Fraunhofer Gesellschaft was all about. Juergen Wolf, head of IZM-ASSID, gave me the grand tour of the 300mm cleanroom and explained the organization’s focus on developing Cu TSV technologies in 300mm wafers for both 2.5D interposer and 3D IC applications. For the past ... »

Mobility and Internet of Things Drive Requirements for Innovative Sensors

Mobility and Internet of Things Drive Requirements for Innovative Sensors

Multitest, a division of LTX-Credence, and  designer and manufacturer of final test handlers, contactors and load boards for the semiconductor manufacturing industry, announces that its humidity test sensors support test of smallest packages sizes at best cost. Multitest sees a clear trend to reduced package sizes for humidity sensor applications. Whereas the first equipment was for MLF4, the l... »

3D IC Commercialization: Glimmers of Progress and Push for Collaboration and Choices to Make

3D IC Commercialization: Glimmers of Progress and Push for Collaboration and Choices to Make

Recent signs that we’re getting closer to commercialization of 3D ICs? For one, analog and sensor IC company, ams AG, threw down the gauntlet, announcing it is investing more than €25M ($33M) to add manufacturing capacity for 3D ICs in its fab located near Graz, Austria. Analog 3D ICs featuring through silicon vias (TSVs) are already a reality at ams. The company introduced its first 3D IC int... »

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Inside the Gadgets at CES 2013

One of these days, I’m going to go to CES. Since 3D integration technology isn’t the focus of the show, I’ve always just followed what other editors reported. But this year after flipping around the video of Qualcomm’s Paul Jacobs’ keynote address, I kind of felt like I missed out on something. One thing is for sure, while Jacob’s assumed a certain level of tech savvyness from the audi... »

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