Plasma

Trymax Launches New UV Curing and Charge-Erase Product Line

Trymax Launches New UV Curing and Charge-Erase Product Line

Trymax Semiconductor Equipment BV (Trymax), a global leader in plasma solutions for semiconductor manufacturers, announces the addition of an ultraviolet (UV) curing and charge-erase product line to its portfolio. The system called NEO 2000UV is a leading-edge dual chamber solution compliant with wafer sizes up to 200mm. UV curing and charge-erase equipment are used for a wide range of application... »

EV Group Optimizes Resist and Lithographic Processing for Plasma Dicing for Advanced Semiconductor Packaging Applications

EV Group Optimizes Resist and Lithographic Processing for Plasma Dicing for Advanced Semiconductor Packaging Applications

EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today announced it is demonstrating optimized pre-processing solutions for the implementation of plasma dicing for advanced semiconductor packaging applications. EVG’s latest products and process development services support this emerging semiconductor back-end fa... »

TSV Inspection

NORDSON: Newcomers to 3D ICs

This is part of a series of short interviews, based on face-to-face meetings at SEMICON West 2013. As 3D ICs get closer to volume manufacturing, we’re seeing newcomers joining the 3D IC party with solutions that help along established process flows, and fill in gaps. Longtime suppliers to the mainstream advanced packaging market, NORDSON Dage and NORDSON March, have each identified areas in 3D I... »