panel-level packaging

Fan-out Panel-level Packaging Comes to the ECTC Technology Corner

Fan-out Panel-level Packaging Comes to the ECTC Technology Corner

On my annual trek around the ECTC Technology Corner, I’m always on the look-out for something new to write about. This year, it quickly became clear by the number of exhibitors displaying their product samples, that one of my blogs would be an update on fan-out panel-level packaging. For the past few years, fan-out panel-level packaging (FOPLP) has been in hot debate: is it needed? Does it REALL... »

Panel Level Packaging: The Next Sleeping Giant? And Other Thoughts From IWLPC 2017

Panel Level Packaging: The Next Sleeping Giant? And Other Thoughts From IWLPC 2017

To the best of my recollection (and a quick search through 3D InCites’ archives) the panel level packaging (PLP) hoopla first hit the conference circuit in 2015 at the International Wafer Level Packaging Conference (IWLPC), when Jan Vardaman made it the topic of a panel discussion, and told a cautionary tale of following PLP down the rabbit hole. It seems that ever since, PLP has been an event h... »

Rudolph Announces Multiple Customers’ Acceptance  of its Firefly Inspection System

Rudolph Announces Multiple Customers’ Acceptance of its Firefly Inspection System

Wilmington, Mass. (September 12, 2017)—Rudolph Technologies, Inc. (NYSE: RTEC) announced today that its Firefly™ Inspection Systems, shipped to fulfill previously announced orders from multiple semiconductor manufacturers, are now qualified for production. The Firefly Inspection Systems provide high-resolution visual and non-visual inspection in a variety of advanced packaging processes, inclu... »

Panel-level Packaging: the High Volume Manufacturing Roadmap has Yet to be Built

Panel-level Packaging: the High Volume Manufacturing Roadmap has Yet to be Built

Over the past few years, it becomes clear that some panel-level packaging choices will be more suitable than others for successful commercial development. So, when will the panel-level packaging industry take off? How will it evolve? “At Yole, we’ve identified five key packaging platforms that can be processed on a larger surface (rectangular/square),” asserts Amandine Pizzagalli, Technology... »