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3D IC Test: Now and The Road Ahead

Solutions for 3D IC test are ready today, but they will be more ready tomorrow. At the 2015 ISTFA, I presented a tutorial titled “What is New in 3D, Digital Testing?” and I’ll summarize the main points here. I consider test standards and test challenges, which include known-good-die and testing stacked die. The two main goals of 3D IC test are to improve the pre-packaged test quality and to ... »