OIP 2018

TSMC Announces SoC Design in the Cloud at the OIP 2018 Ecosystem Forum

TSMC Announces SoC Design in the Cloud at the OIP 2018 Ecosystem Forum

As I prepared to attend TSMC’s OIP 2018 Forum on October 3, 2018 two emails from TSMC caught my attention. They conveyed the news that TSMC just lowered the entry barrier for SoC design significantly by announcing the OIP Cloud Alliance. This is the latest addition to their four Open Innovation Platform Alliances for EDA, IP, Design Services and Value Chain Aggregators. Having promoted Barcelona... »