NAND Flash

What is Happening to the Memory Market?

What is Happening to the Memory Market?

Because memory represents typically about half the silicon content of a system, and multi-die packages typically combine many memory devices with one or more logic dice, I made it a point to attend both Yole Développement’s Executive Memory Breakfast and The Flash Summit on August 6th.  I, along with about 100 other industry executives, had to get up very early to make the 7 am breakfast meeti... »

The Triumph of Quantum Mechanics at the Heart of Solid-State Data Storage

The Triumph of Quantum Mechanics at the Heart of Solid-State Data Storage

If all the data sent worldwide each day on the internet were burned on to CDs and these were then piled one on top of the other, the resulting heap would reach Mars and back again. Much of this data is thankfully not stored on CDs but rather in much more efficient solid-state memories. And at the heart of these is fascinating, some would say weird, fundamental physics that explains a myr... »

EMD Performance Materials Announces Comprehensive Materials Solutions for Chip Miniaturization and Smart Packaging

EMD Performance Materials Announces Comprehensive Materials Solutions for Chip Miniaturization and Smart Packaging

  Philadelphia PA, USA, July 10, 2017 – EMD Performance Materials, a leading science, and technology company, today announced its portfolio of materials solutions for advanced semiconductor manufacturing. Megatrends represented by big data, automotive electronics, IoT, and an increased interest in green assembly, is expanding the need for advanced semiconductor processing and novel materi... »

Samsung’s 3D V-NAND Flash Product: Ceaselessly Marching

Samsung’s 3D V-NAND Flash Product: Ceaselessly Marching

What a feast of information Techinsights has given us on Samsung’s 32-layer 3D V-NAND product! By adding dimensions to the cross sections and including the orthogonal direction, we can now add to what we discerned last time and see how Samsung has built this engineering wonder. As a reminder, Figure 1 shows what I thought was a reasonable guess based on Chipworks analysis. Notice that I couldn... »

Part 3: 3D NAND Flash – Towering Spires or Costly Canyons?

Part 3: 3D NAND Flash – Towering Spires or Costly Canyons?

As promised in Part 2 of this series, in this third installment, I’ll continue to wade into the choppy waters of string current. This is of such importance in any NAND Flash, and especially in the vertical channel 3D NAND Flash approach championed by Samsung and Toshiba that I’ll spend some time describing what it is. Now there is a small coterie that knows everything about this subject, but t... »