MRSI Systems

MRSI Improves Accuracy of MRSI-H/HVM-Series Die Bonders To to 1.5µm

MRSI Improves Accuracy of MRSI-H/HVM-Series Die Bonders To to 1.5µm

MRSI Systems (Mycronic Group) is pleased to announce the latest advancement in the MRSI-H/HVM-series line of die bonders. Placement accuracy was tested using industry-standard glass die reference samples. Results showed enhancement from ±3 µm at 3 sigma, to ±1.5 µm at 3 sigma. Moving forward for shipment starting from October 1, 2019, the product names will be MRSI-H and MRSI-HVM (formerly kno... »

MRSI Systems Welcomes Dr. Limin Zhou as Senior Director of Strategic Marketing

MRSI Systems, part of the Mycronic Group is pleased to announce the appointment of Dr. Limin Zhou as the Senior Director of Strategic Marketing to expand MRSI’s market presence in China. He will be working alongside our existing sales team and representatives in the region. Dr. Zhou’s deep knowledge of the photonics market and his extensive network in the Chinese market will help drive MRSI’... »

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MRSI’s MRSI-H3TO Die Bonding Product Family Supports the 5G Wireless Network Supply Chain

MRSI Systems (Mycronic Group) is launching the MRSI-H3TO, a new 3μm high speed die bonder which will be the first of its kind to address the multi-die and multi-process requirements, delivering industry-leading throughput, superior flexibility, and future-proven 3μm placement accuracy. The MRSI-H3TO is tailored for WDM/EML-TO or other multi-die multi-processing TO-can photonic devices to support... »

MRSI Systems’ New MRSI-HVM3 Die Bonder System Has Entered Volume Production

MRSI Systems’ New MRSI-HVM3 Die Bonder System Has Entered Volume Production

North Billerica, MA, March 6, 2018 – MRSI Systems, a leading provider of fully automated, ultra-precision, high speed die bonding and epoxy dispensing systems is pleased to announce that our new MRSI-HVM3 die bonder system has entered a volume production phase, using advanced Demand Flow Technology (DFT) to satisfy worldwide customer demand. Our ability to deliver the new product with short lea... »

MRSI Systems Launches High-Speed Die Bonder for Photonics High-Volume Manufacturing

MRSI Systems Launches High-Speed Die Bonder for Photonics High-Volume Manufacturing

BILLERICA, Mass., August 14, 2017 – MRSI Systems, a leading manufacturer of fully automated, ultra-precision, high speed die bonding and epoxy dispensing systems, is launching a new High-Speed Die Bonder, MRSI-HVM3, to support our photonics customers’ high volume manufacturing requirements. The MRSI-HVM3 is in full production and we are shipping to customers worldwide. Scaling Imperatives Our... »

MRSI Systems Delivered 3-Micron Die Bonder to AIM Photonics Academy’s Education and Practice Factory at MIT

MRSI Systems Delivered 3-Micron Die Bonder to AIM Photonics Academy’s Education and Practice Factory at MIT

North Billerica, MA, USA, March 20, 2017 — MRSI Systems, a leading provider of fully automated, high-speed, high-precision die bonding and epoxy dispensing systems, today announces the installation of its flagship MRSI-M3 Die Bonder in AIM Photonics Academy’s Education and Practice Factory at the Massachusetts Institute of Technology (MIT) in Cambridge, MA, USA. This is the beginning of a grea... »