Lithography processes

Advanced Packaging Trends – Part II: Solving Lithography Challenges

Advanced Packaging Trends – Part II: Solving Lithography Challenges

Part 1 of this advanced packaging (AP) article series focused on solving photoresist (PR) strip and under bump metallization (UBM) / redistribution layer (RDL) challenges. This article looks at AP trends from a lithography standpoint and proposes solutions to associated lithography challenges. The need for advanced packaging solutions is greater than ever as the world continues to demand increased... »

IMAPS 2014

3D Technology Snapshots from IMAPS 2014

This year’s IMAPS International Symposium purported to have “the most interposer and 3D content under one roof.” I’m not sure about that, but there was certainly enough 3D going on at IMAPS 2014 to spark my interest. Here are some highlights I came away with, based on presentations, interviews with industry suppliers and a stroll around the exhibitor floor. The Glass is Half-Full As Ve... »

Lithography Process Innovations Part 2: Improving Thermo-mechanical Reliability of TSV Interconnects

Lithography Process Innovations Part 2: Improving Thermo-mechanical Reliability of TSV Interconnects

In Part 1 of this article series, we noted that despite the potential benefits associated with 3D and interposer-based 2.5D designs, the incorporation of TSVs poses significant challenges to the performance and reliability of 3D wafer level packages (3D WLP). Among these is the generation of TSV stress in 2.5D/3D packaging – both thermal-induced stress resulting from the coefficient of thermal e... »