industry outlook

Advanced Packaging Trends – Part II: Solving Lithography Challenges

Advanced Packaging Trends – Part II: Solving Lithography Challenges

Part 1 of this advanced packaging (AP) article series focused on solving photoresist (PR) strip and under bump metallization (UBM) / redistribution layer (RDL) challenges. This article looks at AP trends from a lithography standpoint and proposes solutions to associated lithography challenges. The need for advanced packaging solutions is greater than ever as the world continues to demand increased... »

Can We Thank Aristotle for Heterogeneous Integration?

Can We Thank Aristotle for Heterogeneous Integration?

A couple of years ago we may not have predicted that in 2018 there would be a growing demand for high-end chips specifically for global cryptocurrency mining. Those taking part in this search for hashes have a glimmer in their eye similar to those consumed by the hope and frenzy of a gold rush. The rush of getting to the answer first, and of course the alluring reward paid in Bitcoin, is driving p... »

Process Control Gains Importance in Advanced Packaging Applications

Process Control Gains Importance in Advanced Packaging Applications

2016 will be remembered as the year fan-out wafer level packaging (FOWLP) went mainstream, thanks to TSMC’s strategic move in the advanced packaging arena and especially its integrated fan-out (InFO) win inside the iPhone 7. Already in high-volume manufacturing (HVM), FOWLP volumes significantly increased in magnitude. Will this strong momentum continue over the next few years? I believe it will... »

Outlook 2017: Advanced Packaging Technology Takes Center Stage

Outlook 2017: Advanced Packaging Technology Takes Center Stage

The era of “More than Moore” was alive and well in 2016 as the semiconductor industry witnessed many new developments in advanced packaging. Among these was the production of the first hybrid bonded image sensor, which enables high-performance image processing as well as on-sensor memory to provide faster extraction and processing of images. As this image sensor technology enables an entirely ... »

What does 3D Integration mean for your Company in 2015?

What does 3D Integration mean for your Company in 2015?

As December rolls in and 2014 comes to a close, I find myself reflecting on the past 11 months, and the predictions industry experts made in for 2014 in their 3DInCites industry outlooks for 2014. There’s no doubt about it, 2014 has been a good year for 3D integration technologies, with multiple product announcements particularly around 3D stacked memory’s imminent ramp to production. Addi... »