Hot Chips

IFTLE 425: Deca FOWLP is Going Mainstream; Highlights from Hot Chips

IFTLE 425: Deca FOWLP is Going Mainstream; Highlights from Hot Chips

Deca Technologies has confirmed that its M-Series™ fan-out wafer-level packaging (FOWLP) technology has been adopted by Qualcomm for power management integrated circuit (PMIC) devices in Samsung’s S10, the Xiaomi Mi 9 and LG G8 smartphones. And in other news, advanced packaging was the Cinderella Story at Hot Chips 2019. »

Highlights from HotChips 2014: 21 HBM Design-ins Ongoing!

Highlights from HotChips 2014: 21 HBM Design-ins Ongoing!

Last week, HotChips 2014 (aka HC26) was held at the Flint Center within the De Anza College in Cupertino, California. As in many previous years, I attended both the Sunday tutorial and the main conference on Monday and Tuesday. As usual, there were great keynotes and lots of interesting technology news. The tutorial always focuses on an important technology or market trend. This year was no e... »

Moore’s Law is Dead (or Dying) Again?

Moore’s Law is Dead (or Dying) Again?

All good things must come to an end, and apparently Moore’s Law is one of them. But I have to say, it sure is taking its own sweet time. For as long as I’ve been working in this industry (a brief 8 years) – and I suspect even longer than that – people have been predicting the end of Moore’s Law.  The reasons are varied: the laws of physics, technology limits, politics and now economics... »