Hetergeneous Integration

The 14th 3D ASIP Conference Addresses a Spectrum  of 0pportunities, Part 1

The 14th 3D ASIP Conference Addresses a Spectrum of 0pportunities, Part 1

Several years before I started promoting 3D IC benefits in 2008, a small team of industry visionaries founded the 3D Architectures for Semiconductor Integration and Packaging conference (3D ASIP Conference). Rechristened to 3D Architectures for Heterogeneous Integration and Packaging (still 3D ASIP), each December sees several hundred key players from across the supply chain meeting to discuss mar... »

Outlook 2017:  SoC Goes on a Dielet

Outlook 2017: SoC Goes on a Dielet

It’s 2017, and system-on-a-chip (SoC) is headed for a dielet. At least that’s my 2017 outlook, based on takeaways from some of the recent conferences I’ve attended, including, to close out 2016, 3D ASIP last month in Burlingame, CA. SoC has been packing on weight in recent years, and it’s beginning to show, to SoC’s detriment. For example, the old ISO defect density rules from my early I... »

RIP ITRS V1.0: 1992-2015

RIP ITRS V1.0: 1992-2015

Prior to 1992, the high technology industry was ‘immature’. Each supply chain vendor (equipment, materials) would accumulate input from their customers that defined product roadmaps. Vendors cared little about accepting or supplying work-in-progress (WIP) to other vendors’ products. But it became obvious to many that unless they were coordinated, sales potential would be limited. A coordina... »