Global Business Council

Part 2: IMAPS DPC 2017 Covers Range of High-tech Topics, including EDA

Part 2: IMAPS DPC 2017 Covers Range of High-tech Topics, including EDA

The keynotes outlined in Part 1 of IMAPS DPC 2017 Covers Range of High-tech Topics, including EDA were obviously very important, but a relatively small part of the entire conference. After the two keynotes on Tuesday morning, I listened to YOLE’s presentation, delivered by Santosh Kumar, and learned that the three big memory vendors (Samsung, Micron, and Hynix) jointly hold over 200 TSV patents ... »

IMAPS Global Business Council and Device Packaging Symposium in Review

Last week’s event s, held back-to-back at the picturesque Fort McDowell Resort and Casino, Scottsdale, AZ, brought together industry experts, vendors, and academia for a week-long full immersion session in the latest developments of microelectronic device packaging.In addition to the exchange of information and ideas, this remote venue offered attendees and exhibitors a chance to network. Here a... »