glass substrates

Good News about Glass Substrates

Good News about Glass Substrates

Over the years on 3D inCites, we’ve discussed the debate about the advantages and disadvantages of using glass substrates for advanced packaging applications. Thanks to ongoing research and development, a clear path has emerged for the use of glass in two key areas: as carrier substrates for high-density fan-out (FO) packages and as glass interposers for 2.5D integration. At ECTC 2019, I spoke w... »

What is Driving the Growth of the Glass Material Market in Semiconductor Manufacturing?

What is Driving the Growth of the Glass Material Market in Semiconductor Manufacturing?

Used either as a permanent or as a temporary material within the semiconductor manufacturing processes, glass plays a key role in the semiconductor industry. It is today already implemented as a mature solution, in several market segments such as infrared (IR) cut filter for CMOS image sensor (CIS) technology, microfluidics devices and some actuators and sensors. Yole Développement (Yole) confirm... »

Glass Substrates for Advanced Packaging

Glass Substrates for Advanced Packaging

Glass has many properties that make it an ideal substrate for interposers such as: ultra-high resistivity and low electrical loss, low dielectric constant, and adjustable coefficient of thermal expansion (CTE). Leveraging glass-forming processes such as Corning’s fusion forming process provides roughness < 0.5nm rms, and flat substrates with good stiffness. These properties provide opportunit... »