gap analysis

Are there still Gaps in 3D IC Readiness?

Are there still Gaps in 3D IC Readiness?

Good news! At last week’s GSA 3D IC Packaging Working Group Meeting, July 23, 2014, Jan Vardaman uttered the words I’ve been waiting to hear her say for quite some time. “Memory stacks with TSVs are here!” Vardaman cited three companies actively involved in new memory architectures, all of which involve stacking memory either with or without interposers – Tezzaron, Micron and Hynix. She ... »