Fraunhofer IZM-ASSID

European 3D Summit 2018: Fraunhofer Tour and Presentations 

European 3D Summit 2018: Fraunhofer Tour and Presentations 

This year’s European 3D Summit in Dresden, which highlighted “Heterogeneous Integration Driving 3D”, was led off by presentations and a lab tour of the Fraunhofer Institute, whose 18 high-performance centers collaborate with companies, universities and other research institutes in Germany.  All pictures and diagrams courtesy of Fraunhofer IZM. The Fraunhofer IZM presentation was introdu... »

Ziptronix and Fraunhofer IZM-ASSID Collaborate on Development of Low-Cost 3D Integration Solutions

Ziptronix and Fraunhofer IZM-ASSID Collaborate on Development of Low-Cost 3D Integration Solutions

SAN JOSE, Calif. — Ziptronix, Inc., a wholly owned subsidiary of Tessera Technologies, Inc. (NASDAQ:TSRA) (“Tessera” or the “Company”) and the leader in low temperature wafer bonding technology, today announced it has entered into a development agreement with Fraunhofer IZM-ASSID (“Fraunhofer”). The companies will work together to integrate Ziptronix Direct Bo... »

Silicon Saxony: Leading the Charge in More than Moore

Silicon Saxony: Leading the Charge in More than Moore

Since the days even before the reunification of Germany; Saxony, and particularly Dresden, has been a vital center for microelectronics development in Europe. And since the reunification, Dresden has focused its investments on a single area: high technology and affiliated research. Both GLOBALFOUNDRIES and Infineon have a significant presence here, as well as many divisions of the Fraunhofer-Gese... »

3D IC Test

3D TSV without Limits

What can we expect out of 2.5 and 3D TSV Integration? What are the three leading-edge R&D institutes in 2.5 and 3D TSV investigating? On November 18, SEMI offered a webinar entitled “3D TSV without Limits.” Francoise von Trapp of 3D InCites moderated the webinar which featured Eric Beyne, director of 3D System Integration program at imec, Herve Ribot, head of 3D at CEA-LETI and Juergen Wol... »

Juergen Wolf, Fraunhofer IZM-ASSID

Fraunhofer IZM Update with M. Juergen Wolf

I’ve been on a mission to interview the directors of all three European microelectronics research centers that are participating in the European 3D TSV Summit before the event takes place. So far I’ve checked imec and Leti off the list. Last week, I finally was able to achieve the trifecta when Juergen Wolf of Fraunhofer IZM had time to sit down during the 3D Architectures for Systems Integrat... »

At Fraunhofer IZM-ASSID, It’s All Silicon, All the Time

One of 60 research institutes that make up Germany’s Fraunhofer Gesellschaft, the Fraunhofer Institute for Reliability and Microintegration IZM is known worldwide for its work in the realm of microelectronic packaging and system integration. The center ASSID (which stands for All Silicon System Integration Dresden) was established as a division of Fraunhofer IZM with the core mission of developi... »

Altatech Semiconductor’s 300 mm CVD System Being Used in 3D IC Pilot Production at ASSID

All Silicon System Integration Dresden (ASSID), a leading-edge microelectronic wafer-level packaging and system integration center operated by the Fraunhofer IZM Institute, has begun pilot-line production of 3D semiconductor devices using a single-wafer, multi-chamber AltaCVD 300 system from Altatech Semiconductor S.A. At Fraunhofer IZM-ASSID’s 970-square-meter cleanroom facility in Dresden, Al... »

Fraunhofer IZM-ASSID’s System Approach to 3D

My recent visit to EV Group at its headquarters in Schärding, Austria, included some time spent with M. Jürgen Wolf, who, as part of his management and coordination of Fraunhofer IZM-ASSID (All System Silicon Integration Dresden) is the program & project manager for 3D Wafer Level System Integration (WLSI) and wafer-level packaging (WLP). There’s been a lot of activity going on with Frau... »