This year’s European 3D Summit in Dresden, which highlighted “Heterogeneous Integration Driving 3D”, was led off by presentations and a...
SAN JOSE, Calif. — Ziptronix, Inc., a wholly owned subsidiary of Tessera Technologies, Inc. (NASDAQ:TSRA) (“Tessera” or the “Company”) and...
Since the days even before the reunification of Germany; Saxony, and particularly Dresden, has been a vital center for microelectronics development...
What can we expect out of 2.5 and 3D TSV Integration? What are the three leading-edge R&D institutes in 2.5...
I’ve been on a mission to interview the directors of all three European microelectronics research centers that are participating in...
One of 60 research institutes that make up Germany’s Fraunhofer Gesellschaft, the Fraunhofer Institute for Reliability and Microintegration IZM is...
All Silicon System Integration Dresden (ASSID), a leading-edge microelectronic wafer-level packaging and system integration center operated by the Fraunhofer IZM...
My recent visit to EV Group at its headquarters in Schärding, Austria, included some time spent with M. Jürgen Wolf,...