Indium Corporation: Wafer Flux WS-3543

Indium Corporation: Wafer Flux WS-3543

Indium Corporation’s wafer bumping flux WS-3543 is a low-viscosity semiconductor-grade flux, specifically optimized for uniform solder bump formation across wafers up to 300mm (12 inches) in diameter. WS-3543 washes off completely, even after repeated application, reflow, and cleaning cycles, as may be seen in bump rework and after probe testing. Testimonial Indium Corporation’s wafer bumping ... »

courtesy of NORDSON Asymtek

Is it Time for Fluxless Processes for 3D Packaging?

A 3D InCites reader recently inquired whether cost drivers and fine-pitch requirements in 3D applications are moving manufacturers away from flux towards fluxless processes in the bumping steps for both bump formation and assembly.To answer this question, 3D InCites turned to the materials and equipment experts, speaking with Jeff Calvert, Global R&D Director, Advanced Packaging Technologies a... »