The annual International Electron Devices Meeting (IEDM) presents the latest developments in electronic device technologies focused on advanced scaling, heterogeneous integration, quantum computing, and wide bandgap devices. Among several excellent papers on 3D integration were two papers on 3D sequential integration, long the holy grail of 3D integration because of the promise of up to 50% logic-... »
When Yogi Berra made this very wise statement, he certainly didn’t mean to give specific advice what to choose. I interpret his statement as an encouragement to make an educated decision and pick the best alternative, whenever you come to a fork in the road. The semiconductor industry is facing such a fork in the road to continued success. As the attached slide from last year’s CDN Live confer... »
Guest Blogger, Paul Werbaneth, shares his take-aways on 3D ICs at the last week’s Common Technology Platform There was little advance promotion of 3D IC topics at the well-promoted Common Platform Tech Forum 2013 event, held this year at the Santa Clara (CA) Convention Center on Tuesday 05 February 2013, but I figured that, just like Gary Larson’s famous dog Ginger, my selective hearing on... »
Previews of IEDM 2012, which got underway today in San Francisco, indicate a program this year rich in content on 3D transistors and 3D memory technologies, with very little focus on 3D ICs using TSVs. My take on this is that IEDM papers are generally focuses on processes and technologies in early development. So while there was a lot to talk about in past years, 3D TSV technologies have matured p... »
With all the latest hubbub about FinFets (or as Intel calls them, TriGate transistors) , there seems to be some confusion in terminology, leading to confusion in who’s doing what first. First and foremost, the technology Intel claims to have pioneered is 3D transistors, also known generically as FinFets. TSMC has also announced that they will move forward with FinFets. What people need to under... »
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