FD SOI

Cladogenesis: The Clouds Parted Over California to Reveal … IoT, MEMS, FD-SOI, and Heterointegration

Cladogenesis: The Clouds Parted Over California to Reveal … IoT, MEMS, FD-SOI, and Heterointegration

The semiconductor fabrication industry has been wandering in something of a wilderness recently, what with the continued delays in EUV lithography as a production-ready technology, 450mm gone quiet, ‘teenage’ FinFET costs zooming, and the baton in single-digit nanometer FinFET passing from Intel to IBM and its partners. It’s a situation that made SEMICON West 2015 most interesting. There was... »

EDPS 2015 Looks At IC Innovations from the Design Perspective

EDPS 2015 Looks At IC Innovations from the Design Perspective

On Thursday and Friday of last week, Monterey, California’s previous state capital, became the center of presentations and discussions about IC design challenges as well as latest innovations / progress made in the field of EDA tools and IC design methodologies at Electronic Design Process Symposium (EDPS) 2015. We also learned a lot about FinFETs and FD-SOI during Thursday morning’s keynote... »

Should EDA vendors, OSATS, and their customers cooperate more?

Should EDA vendors, OSATS, and their customers cooperate more?

Last week, I attended the packaging-focused 64th Electronic Components and Technology Conference (ECTC) 2014 in Orlando. This week I spent three days at the EDA-focused 51st Design Automation Conference in San Francisco. In addition to realizing that these two locations are about three thousand miles apart, I noticed that the packaging and EDA camps are still far apart in regards to share of mind ... »