EDA Design

EDA Design Tools/Flows Targeting WLP Featured at IWLPC 2018

EDA Design Tools/Flows Targeting WLP Featured at IWLPC 2018

Wafer and panel-level packaging (WLP/PLP) offers technical and business advantages, compared to traditional IC packages. These cost-effective packaging solutions attracted more than 800 industry experts to the International Wafer Level Packaging Conference (IWLPC 2018) in San Jose’s DoubleTree Hotel at the end of October. In case you were wondering, a multi-die WLP design, created with the tools... »