EDA design tools.

EDA Design Tools/Flows Targeting WLP Featured at IWLPC 2018

EDA Design Tools/Flows Targeting WLP Featured at IWLPC 2018

Wafer and panel-level packaging (WLP/PLP) offers technical and business advantages, compared to traditional IC packages. These cost-effective packaging solutions attracted more than 800 industry experts to the International Wafer Level Packaging Conference (IWLPC 2018) in San Jose’s DoubleTree Hotel at the end of October. In case you were wondering, a multi-die WLP design, created with the tools... »

New Design Flow and OSAT Alliance Program Jump-Start High-density Advanced Packaging

New Design Flow and OSAT Alliance Program Jump-Start High-density Advanced Packaging

Editor’s note: For several years now, Mentor Graphics has evangelized about the critical need for assembly design kits to enable commercialization of high-density advanced packaging technologies, such as fine line and space fan-out, 2.5D and 3D IC packages. With this week’s introduction of a unique, end-to-end, high-density advanced packaging (HDAP) design flow, combined with the launch of an... »

Show Me The Money: 3D Friday at EDPS

While it was Good Friday for most, it was 3D Friday for those of us who attended the 19th Annual Electronic Design Process Symposium (EDPS), held last week in Monterey CA. What an amazing location! For an ocean-starved desert dweller like me, it was hard to tear my eyes off the waves and pay attention at what was going on in the front of the room... but I managed and it was definitely worth tuning »

Who Wins With 3D Stacking?

In this editorial commentary, blogger Ed Sperling, of the Low Power Engineering community, talks about the opportunities 3D stacking technologise pose for EDA start-ups and vendors. There seems to be little doubt that the semiconductor industry is moving to 3D stacking. It’s simply too expensive for most companies to develop SoCs at advanced nodes from scratch when they can use existing ... »