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Lam Research: SABRE 3D

Lam Research: SABRE 3D

SABRE® 3D is a next-generation electroplating product designed to meet leading-edge production requirements for advanced packaging applications.  This product leverages proprietary front-end manufacturing technology and offers market-specific solutions for copper pillar and through-silicon via (TSV) fabrication.  SABRE 3D offers industry-leading throughput along with reduced cost of consumabl... »

Process Improvements Target 3D IC Cost of Ownership

Process Improvements Target 3D IC Cost of Ownership

Customers have asked and suppliers are listening. One sign of progress from last year to this year at SEMICON Singapore’s 3D IC Forum was the number of supplier presentations focused on process improvements that have been developed to lower the 3D IC cost of ownership (CoO). In addition to the cost-effective implementation of interposer technologies being worked on at Singapore’s A*STAR Instit... »

NEXX Systems Joins Tokyo Electron (TEL) as a Wholly Owned Subsidiary

Tokyo Electron Limited announced the completion of a definitive acquisition agreement with NEXX Systems Inc. Over the years, NEXX collaborated with TEL to study process technology in advanced packaging equipment for the development of 3D Thru Silicon Vias (TSV), giving both companies an opportunity to work together and setting the stage for TEL's acquisition of NEXX. Rapid growth of smart phones, »