Dow Electronic Materials

2018 Industry Outlook: It’s Time to Get Serious about 5G

2018 Industry Outlook: It’s Time to Get Serious about 5G

While the entire semiconductor industry is buzzing about explosive and sustained growth well into the 2020s driven by smart everything (homes, cities, industry), automotive electronics, artificial intelligence and more, what’s truly exciting is how we are going to support the connectivity of all those applications. 5G is where it all comes together. Without it, connecting all this disparate data... »

What the Heterogeneous Integration Technology Roadmap Will Mean for 2017

What the Heterogeneous Integration Technology Roadmap Will Mean for 2017

While it seems that the semiconductor industry has suddenly embraced heterogeneous integration as the next revolutionary innovation to further the quest for higher performance and lower-power, lower-cost devices, it has actually been developing over the past four or more years. We at Dow Electronic Materials, along with many others in the industry, have been and continue to be active participants ... »

Shifting Packaging Landscape brings Both Challenges and Growth

Shifting Packaging Landscape brings Both Challenges and Growth

2015 overall was a mixed year for the materials sector in the electronics market, with a general slowdown in PC-related segments offset by continued growth in mobile smart phones and other handheld devices despite industry growth flattening out late in 2015. In 2016, market forecasts indicate some improved growth and potential technology shifts. Looking at the 3D IC packaging market specifically, ... »

Dow Electronic Materials Wins Prestigious R&D 100 Award for  SOLDERON™ Tin-Silver Plating Chemistry

Dow Electronic Materials Wins Prestigious R&D 100 Award for SOLDERON™ Tin-Silver Plating Chemistry

MARLBOROUGH, Mass. – Nov. 17, 2015 – Dow Electronic Materials, a business unit of The Dow Chemical Company (NYSE:DOW), today announced that its SOLDERON™ BP TS 6000 Tin-Silver plating chemistry has received a prestigious R&D 100 Award, recognizing it as one of the top 100 innovations of the past year. The chemistry joins six other Dow products honored by R&D Magazine at its R&D 1... »

Dow Introduces SOLDERON Tin-Silver Plating Chemistry for Lead-Free Bumping

Dow Introduces SOLDERON Tin-Silver Plating Chemistry for Lead-Free Bumping

The company’s next-generation SnAg offers industry-leading plating rates and process flexibility for flip chip packages and interconnects. Dow Electronic Materials today launched its SOLDERON™ BP TS 6000 Tin-Silver Plating Chemistry for use in lead-free bumping applications. This next-generation formulation features enhanced plating performance, bath stability and ease-of-use, thereby enab... »

Technology Updates at ECTC 2013

Technology Updates at ECTC 2013

The ECTC 2013 stats are in. This year showed increases across the board with: Over 1,300 attendees, the highest attendance ever, from 26 countries 377 technical papers, presented in 36 oral and five interactive presentation sessions, including a student poster session 12 sessions focused on 3D/TSV, including several of the best attended sessions of the conference 16 professional development course... »