Dow Corning

Dow Corning: Thermally Conductive Gel TC-3040

Dow Corning: Thermally Conductive Gel TC-3040

TC-3040 is designed for advanced flip chip devices requiring improved heat dissipation.  The material features a combination of low modulus and high elongation – enabling it to accommodate warpage-induced stresses.  Key to the improved thermal performance : low contact resistance that silicones are known for, along with proprietary filler technology. Testimonial While advanced 2.5D or 3D... »

ECTC 2015 Supplier Update

ECTC 2015 Supplier Update

While Herb Reiter dove deep into the technology sessions at ECTC 2015, I spent most of my time picking the brains of suppliers who have introduced products targeting advanced wafer level packaging and 3D ICs. Overall, I’ve noticed efforts are becoming really targeted, and are focused on remaining challenges like thermal management, improving yields, and increasing throughput, addressing a... »

Are Design Tools and Thermal Solutions the Missing Links to 2.5D and 3D IC Production?

Are Design Tools and Thermal Solutions the Missing Links to 2.5D and 3D IC Production?

On one side of the fence, we have semiconductor device manufacturers (fabs, foundries, and OSATS) claiming to be ready to ramp 2.5D and 3D IC devices to production, saying that remaining issues can be engineered out. On the other side, we have system integrators who, while they believe 2.5D and 3D ICs are the answer to their performance and power prayers, aren’t ready to dive in head first becau... »

Dow Corning Joins EV Group’s Open Platform for Temporary Bonding Materials for 3D-IC Manufacturing

Dow Corning Joins EV Group’s Open Platform for Temporary Bonding Materials for 3D-IC Manufacturing

Both Innovators Join Forces to Offer Simple, Cost-Effective Temporary Bonding/Debonding Solution for High-Performance 3D-IC Packaging ST. FLORIAN, Austria, Sept. 3, 2013 — EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, announced today that Dow Corning has joined its network of top technology providers to suppo... »

Figure 2: Shows the photo of a 50 μm thin wafer after debond on a tape.

Dow Corning offers the Power of Silicone Technology

This is part of a series of short interviews, based on face-to-face meetings at SEMICON West 2013. After my interview with imec’s Ludo Deferm, I met up with Andrew Ho, global industry director, advanced semiconductor materials, for Dow Corning’s Electronic Solutions, to get an update on Dow Corning’s developments in 3D IC assembly materials. I’d previously interviewed Ho’s colleague,... »

Thinned wafer image, courtesy of imec

Interview with imec’s Ludo Deferm: Packaging Design Kits and Debond Solutions

For me, SEMICON West involves a careful balance of attending sessions, keynotes and panels, combined with one-on-one interviews with thought leaders in 3D ICs, as well as manufacturing suppliers who have the onerous task of developing, promoting, and selling the next great solution for 2.5D and 3D IC manufacturing. Over the course of the 3 days, things I hear percolate in my head, and form questio... »

And a Good Time was had by All – 3D InCites Awards Breakfast, 2013

And a Good Time was had by All – 3D InCites Awards Breakfast, 2013

Despite the chilly San Francisco morning temperatures, a sizable crowd of 2.5D and 3D enthusiasts gathered at the Impress Lounge to witness the inaugural 3D InCites Awards Breakfast, held July 11, 2013 during SEMICON West. For me, it was especially significant as it marked four years since I first launched 3D InCites at SEMICON West 2009. I felt truly honored to be surrounded by such industry elit... »

ECTC 2013 Interview: Dow Corning throws its Hat in the Temporary Bond/Debond Ring

ECTC 2013 Interview: Dow Corning throws its Hat in the Temporary Bond/Debond Ring

At ECTC 2013, Dow Corning Corporation (DCC) introduced its solution to the temporary bond/debond conundrum. During the materials and process session, Ranjith John, materials development & integration engineer at Dow Corning, presented a paper titled Low Cost, Room Temperature Debondable Spin on Temporary Bonding Solution: A Key Enabler for 2.5D/3D IC Packaging, co-authored with equipment suppl... »

Dow Corning and SÜSS MicroTec Report New Temporary Bonding Solution for 2.5D and 3D IC Packaging at ECTC 2013

Dow Corning and SÜSS MicroTec Report New Temporary Bonding Solution for 2.5D and 3D IC Packaging at ECTC 2013

The semiconductor industry’s march toward broader 3D IC integration marked an important milestone this week at the 2013 Electronic Components & Technology Conference (ECTC), with the report of an advanced new temporary bonding solution for 3D Through Silicon Via (TSV) semiconductor packaging. The breakthrough was unveiled during ECTC’s 3D Materials and Processing session, when Ranjith John... »