die bonders

MRSI Systems welcomes Hendry He as China Country Sales Director

MRSI Systems welcomes Hendry He as China Country Sales Director

MRSI Systems (Mycronic Group) is pleased to announce our new China Country Sales Director, Hendry He. He will be working alongside the existing sales team and representatives in the region and is based in Shanghai. His substantial technical experience selling semiconductor equipment along with his vast network in the Chinese market is guaranteed to even further enhance our responsiveness to our cu... »

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MRSI Systems’ MRSI-HVM3P Extends The MRS-HVM3 Die Bonder Family to New Applications

BILLERICA, Massachusetts, USA, August 20, 2018 – MRSI Systems (Mycronic Group), is expanding its leading high-speed MRSI-HVM3 die bonder platform with the launch of the MRSI-HVM3P to offer configurations for active optical cable (AOC), gold-box packaging, and other applications in addition to chip-on-carrier (CoC). This expansion is in response to our customer’s request to take advantage of t... »

MRSI Systems’ New MRSI-HVM3 Die Bonder System Has Entered Volume Production

MRSI Systems’ New MRSI-HVM3 Die Bonder System Has Entered Volume Production

North Billerica, MA, March 6, 2018 – MRSI Systems, a leading provider of fully automated, ultra-precision, high speed die bonding and epoxy dispensing systems is pleased to announce that our new MRSI-HVM3 die bonder system has entered a volume production phase, using advanced Demand Flow Technology (DFT) to satisfy worldwide customer demand. Our ability to deliver the new product with short lea... »

Finetech’s Sigma Die Bonder High Accuracy Targets Advanced Wafer Level Packaging Applications

Finetech’s Sigma Die Bonder High Accuracy Targets Advanced Wafer Level Packaging Applications

GILBERT, AZ — August 6, 2015 — Finetech introduces its new FINEPLACER® Sigma bonder, designed to provide a solution for large die up to 100mm, combined with a working area of 450 x 300mm. The FINEPLACER® Sigma is ideally suited for high-density array applications and high bond force (up to 1000N) requirements, coupled with Finetech’s renowned sub-micron placement accuracy. The system is t... »

Endlich Freitag! 3D Buzz

Guten Tag! It’s Friday already? I’m not sure where that week went, but I managed to gather some interesting 3D tidbits throughout the course of it. Let’s begin with Sally Adee’s 3D coverage of IEEE’s International Solid-State Circuits Conference that took place in San Francisco this week. »