design tools

U2U 2019 Conference Dives into 2.5/3D IC Design

U2U 2019 Conference Dives into 2.5/3D IC Design

Key advanced packaging technology influencers came out in force to discuss the status of  EDA tools for 2.5D/3D IC package design at the recent User to User (U2U 2019) Conference, organized by Mentor, A Siemens’ Business and hosted at the Santa Clara Marriott. Presenters from Wave Computing, ARM, Amkor, TechSearch International Inc., and Qualcomm lent their voices to the cause. Technology T... »

GSA Silicon Summit: What’s next for the 2.5D/3D Ecosystem?

GSA Silicon Summit: What’s next for the 2.5D/3D Ecosystem?

Due to schedule conflicts, I was unable to attend this year’s Silicon Summit, which took place April 10, 2014 at the Computer History Museum, and featured a segment titled GSA Silicon Summit 2014: 2.5D/3D Ecosystem – What’s Next? Luckily, Rick McClellen, director of business development at Ziptronix briefed me on the event key takaways, which I’ve noted here and offered some of my own obse... »