DAC

SEMICON West 2015 Demonstrates the Powerful IC Manufacturing Base

SEMICON West 2015 Demonstrates the Powerful IC Manufacturing Base

A few weeks ago, San Francisco’s Moscone Center hosted the Design Automation Conference (DAC 2015), with many EDA experts and their customers focused on how to design the new wave of 10nm chips, this year and next. Last week the Moscone Center was buzzing again, this time with material suppliers, equipment vendors, and IC manufacturing experts, discussing how to ramp up production and improve yi... »

Should EDA vendors, OSATS, and their customers cooperate more?

Should EDA vendors, OSATS, and their customers cooperate more?

Last week, I attended the packaging-focused 64th Electronic Components and Technology Conference (ECTC) 2014 in Orlando. This week I spent three days at the EDA-focused 51st Design Automation Conference in San Francisco. In addition to realizing that these two locations are about three thousand miles apart, I noticed that the packaging and EDA camps are still far apart in regards to share of mind ... »

June Event Highlights in 3D

Note to self: no more graduations/college orientations/vacations in the month of June. There are way too many events in 3D and I missed so much while I was off focusing on other things! Lucky for me, people writing and blogging about 3D technologies are coming out of the woodwork, and so as I catch up on my reading, I’ll point you to some of the key points made by my capable colleagues in the 3D »

Monday 3D Mash-up

For most of July I focused on coverage of SEMICON West in 3D.  Today, I thought I’d take a look at what else people were talking about in 3D space over the past few weeks. The Water Cooling IssueTwo bloggers took on the topic of water cooling 3D IC assemblies as a way to handle the heat. Brian Bailey got the ball rolling in his interview with Madhavan Swaminathan, who wears many hats in the 3D »