Cu pillars

Dow Electronic Materials Wins Prestigious R&D 100 Award for  SOLDERON™ Tin-Silver Plating Chemistry

Dow Electronic Materials Wins Prestigious R&D 100 Award for SOLDERON™ Tin-Silver Plating Chemistry

MARLBOROUGH, Mass. – Nov. 17, 2015 – Dow Electronic Materials, a business unit of The Dow Chemical Company (NYSE:DOW), today announced that its SOLDERON™ BP TS 6000 Tin-Silver plating chemistry has received a prestigious R&D 100 Award, recognizing it as one of the top 100 innovations of the past year. The chemistry joins six other Dow products honored by R&D Magazine at its R&D 1... »

Dow Electronic Materials: SOLDERON™ BP TS 6000 Tin-Silver Chemistry

Dow Electronic Materials: SOLDERON™ BP TS 6000 Tin-Silver Chemistry

SOLDERON™ BP TS 6000 Tin-Silver is a lead-free chemistry for solder bump applications. From a single formulation, it is capable of plating speeds of 2-9+ µm/min, tunable composition and the industry’s most robust process window. This flexibility makes it ideal for applications from C4 bumping to micro-Cu pillar capping. Testimonial In the latest 2.5D and 3D packaging schemes utilizing copper ... »

A Solder Bump Expert’s Take on the Expanding World of Advanced Packaging

A Solder Bump Expert’s Take on the Expanding World of Advanced Packaging

An interesting take-away from the keynote talk delivered by Brandon Prior, Prismark Partners, at this year’s IMAPS International Device Packaging Conference, held March 11-13 in Fountain Hills, AZ, was the observation that just because new advanced packaging types are being introduced to the market, it doesn’t mean that older ones are dropping off or becoming obsolete. As a result, wha... »

Dynaloy: A Formula for Cleans

Dynaloy: A Formula for Cleans

It’s hard to believe that inside such a non-descript building set back down a picturesque country lane in (almost) rural Indiana, really cool things are happening. This is the home of Dynaloy, LLC, a subsidiary of Eastman Chemical Company, where innovative chemical formulations are being developed to remove the most stubborn of photoresists and polymer residues left behind during semiconductor m... »