Cu pillar bumps

Dow Electronic Materials: SOLDERON™ BP TS 6000 Tin-Silver Chemistry

Dow Electronic Materials: SOLDERON™ BP TS 6000 Tin-Silver Chemistry

SOLDERON™ BP TS 6000 Tin-Silver is a lead-free chemistry for solder bump applications. From a single formulation, it is capable of plating speeds of 2-9+ µm/min, tunable composition and the industry’s most robust process window. This flexibility makes it ideal for applications from C4 bumping to micro-Cu pillar capping. Testimonial In the latest 2.5D and 3D packaging schemes utilizing copper ... »

Dow’s SOLDERON™ Tin-Silver Plating Chemistry Wins Prestigious Bronze Edison Award

Dow’s SOLDERON™ Tin-Silver Plating Chemistry Wins Prestigious Bronze Edison Award

MARLBOROUGH, MA – April 27, 2015 – Dow Electronic Materials, a business unit of The Dow Chemical Company (NYSE:DOW), today announced that its SOLDERON™ BP TS 6000 Tin-Silver Plating Chemistry was honored as a Bronze 2015 Edison Award winner in the Material Science: Manufacturing category. Removing lead from solders used in electronics is a difficult technical challenge because it has unique ... »

Rudolph Announces New SONUS Technology and Collaboration with TEL NEXX for Advanced Packaging Process Control

Rudolph Announces New SONUS Technology and Collaboration with TEL NEXX for Advanced Packaging Process Control

Non-contact, non-destructive acoustic technology fulfills growing need in advanced packaging for thick film metrology up to 100μm and void detection down to 0.5μm Flanders, New Jersey (July 21, 2014)—Rudolph Technologies, Inc. (NYSE: RTEC) announced today the availability of its new SONUS™ Technology, designed for measuring thick films and film stacks used in copper pillar bumps and for dete... »