CoolCube

CoolCube™: More than a True 3D VLSI Alternative to Scaling

CoolCube™: More than a True 3D VLSI Alternative to Scaling

Almost four years ago, we published an article titled “CoolCube™: A True 3DVLSI Alternative to Scaling” on 3D InCites. It described the concept of stacking layers of transistors sequentially on top of each other and documented the research effort happening at Leti to develop a feasible process integration scheme and a comprehensive product design frame. Now, four years later, we can say that... »

Breakthroughs in 3D Stacked FinFETS and 3D Sequential Integration

Breakthroughs in 3D Stacked FinFETS and 3D Sequential Integration

The annual International Electron Devices Meeting (IEDM) presents the latest developments in electronic device technologies focused on advanced scaling, heterogeneous integration, quantum computing, and wide bandgap devices. Among several excellent papers on 3D integration were two papers on 3D sequential integration, long the holy grail of 3D integration because of the promise of up to 50% logic-... »

3D VLSI is the New Active Interposer

3D VLSI is the New Active Interposer

 3D very large system integration (3D VLSI) has many aliases. This high-density approach to 3D system integration first appeared on the scene as monolithic 3D (M3D), or as Leti dubbed it: sequential 3D. In 2014, the French research institute officially introduced it as CoolCube™ because this version of the technology addressed the thermal issues that plagued early versions of M3D. This paved th... »

Taking 3D Integration to the Next Level

Taking 3D Integration to the Next Level

There is no rest for the weary. Just because we can finally declare that 3D ICs are in production doesn’t mean we’re done working on it. To the contrary, efforts are ongoing at research institutes like imec in Belgium and Leti in France to take 3D integration to the next level. imec Driven by what imec’s Luc van den hove called “the intuitive internet of things (I-IOT)” the heat is on to... »

DATE 2015 demonstrates Europe’s commitment to Semiconductors, Part 2

DATE 2015 demonstrates Europe’s commitment to Semiconductors, Part 2

Continuing from Part 1: On Thursday morning I really enjoyed the Monolithic 3D session. Francoise already reported about it, so I can be brief and focus on the most advanced program presented, the CEA Leti CoolCube™ . Olivier Billoint showed and explained how Leti, in cooperation with an EDA partner, is developing the integration of two layers of functions on a wafer. The first layer uses a reg... »

CoolCube™: A True 3DVLSI Alternative to Scaling

CoolCube™: A True 3DVLSI Alternative to Scaling

Stacking transistors on top of each other sequentially in the same front-end process flow is a concept that has been imagined to provide the semiconductor community with an alternative to the traditional scaling paradigm challenged by technical and cost roadblocks. LETI Advanced CMOS Laboratory introduced CoolCube™, a low-temperature process flow that provides a true path to 3DVLSI. »

Monolithic 3D IC Heats Up at DATE 2015

Monolithic 3D IC Heats Up at DATE 2015

Despite the fact that monolithic 3D IC is still very much in development stages, its promise to gain a full node in terms of power and performance while eliminating the need for TSVs, gained it “Hot Topic” status at this year’s Design and Test Europe (DATE 2015) which took place in Grenoble, March 9-13, 2015, with an entire session of design-focused presentations devoted to it. Monolithic, o... »