complex packaging

A Perfect Storm is Brewing for Complex Packaging in 2016

A Perfect Storm is Brewing for Complex Packaging in 2016

If I had not attended the 2015 3D ASIP conference, my outlook for 2016 would have been less upbeat for complex packaging (2.5/3D). But this conference showed that companies and their development organizations are NOT solely looking towards FinFETS and sub 20nm silicon process nodes to meet their integration, power, speed, weight, etc metrics.   We are in the perfect storm: out of control costs a... »