ADKs

Highlights From MEPTEC’s 2018 Heterogeneous Integration Symposium

Highlights From MEPTEC’s 2018 Heterogeneous Integration Symposium

The Microelectronics Packaging and Test Engineering Council (MEPTEC) held its annual heterogeneous integration symposium at SEMI’s headquarters in Milpitas, CA on December 5, 2018. Many manufacturing and test, as well as electronic design automation (EDA) and IC design experts, got together to present and discuss how to integrate heterogeneous functions in advanced IC packages to better meet cus... »

Why Do We Need Assembly Design Kits for Packages?

Why Do We Need Assembly Design Kits for Packages?

In our last article, we talked about a project we participated in to test the feasibility of an assembly design kit (ADK) for package design verification. This time, we’d like to delve a little more into the reasons why assembly design kits are needed. Naturally, one of the reactions to our article was “But I already have requirements from my package house. Why do I need an ADK?” True, packa... »

Ideas for Co-optimizing Chip-Package Design

Ideas for Co-optimizing Chip-Package Design

In a recent blog sharing my impressions of July’s Semicon West, I complained a bit about the lack of substantial IC packaging topics at this large IC manufacturing conference and also mentioned that I had observed the same problem at June’s Design Automation Conference. I am glad that I was fairly diplomatic with my complaint, because the day after Francoise posted my blog, SEMI, our industry... »

DATE 2015 demonstrates Europe’s commitment to Semiconductors, Part 2

DATE 2015 demonstrates Europe’s commitment to Semiconductors, Part 2

Continuing from Part 1: On Thursday morning I really enjoyed the Monolithic 3D session. Francoise already reported about it, so I can be brief and focus on the most advanced program presented, the CEA Leti CoolCube™ . Olivier Billoint showed and explained how Leti, in cooperation with an EDA partner, is developing the integration of two layers of functions on a wafer. The first layer uses a reg... »