ADK

Implementing High-Density Advanced Packaging for OSATs and Foundries

Implementing High-Density Advanced Packaging for OSATs and Foundries

Moore’s law is increasingly difficult to maintain and is driving the growth of innovative high-density advanced packaging (HDAP) technologies in response to system scaling demands. These innovations are increasingly in the form of fan-out wafer level packaging (FOWLP) or multi-substrate / multi-device packages like interposers and system-in-package (SiP). New challenges come with these disruptiv... »

Getting IC Package Design Right the First Time

Getting IC Package Design Right the First Time

Once considered to be one of the simpler tasks in semiconductor device manufacturing, IC package design has become more complicated as it becomes more critical to the performance of the end-devices.  Market drivers are more varied than ever. Time-to-market is more critical than ever.  And advanced packaging options are more numerous than ever. In this exclusive interview with Keith Felton of Me... »

Executive Viewpoint: Breaking The Chicken and Egg Cycle for HDAP

Executive Viewpoint: Breaking The Chicken and Egg Cycle for HDAP

  For several years now, Herb Reiter, eda2asic, and John Ferguson, Mentor Graphics, have been evangelizing about the necessity of assembly design kits (ADK), similar to the process design kits (PDKs) for chip designers, to help drive ecosystem capabilities for what is collectively now being called high density advanced packaging (HDAP), comprising 2.5D IC, 3D IC and high density fan-out wafer... »

New Design Flow and OSAT Alliance Program Jump-Start High-density Advanced Packaging

New Design Flow and OSAT Alliance Program Jump-Start High-density Advanced Packaging

Editor’s note: For several years now, Mentor Graphics has evangelized about the critical need for assembly design kits to enable commercialization of high-density advanced packaging technologies, such as fine line and space fan-out, 2.5D and 3D IC packages. With this week’s introduction of a unique, end-to-end, high-density advanced packaging (HDAP) design flow, combined with the launch of an... »

Why Do We Need Assembly Design Kits for Packages?

Why Do We Need Assembly Design Kits for Packages?

In our last article, we talked about a project we participated in to test the feasibility of an assembly design kit (ADK) for package design verification. This time, we’d like to delve a little more into the reasons why assembly design kits are needed. Naturally, one of the reactions to our article was “But I already have requirements from my package house. Why do I need an ADK?” True, packa... »

Assembly Design Kits are the Future of Package Design Verification

Assembly Design Kits are the Future of Package Design Verification

Unlike the traditional system-on-chip (SoC) design process, which has fully qualified verification methods embodied in the form of process design kits (PDKs), chip design companies and assembly houses have no integrated circuit (IC) package co-design sign-off verification process to help ensure that an IC package will meet manufacturability and performance requirements. Package die are often produ... »