450mm

Are Chip Architects Finally Climbing on the 2.5D and 3D Bandwagon?

Are Chip Architects Finally Climbing on the 2.5D and 3D Bandwagon?

Ever since SEMICON West 2014, I’ve been seeing a lot of coverage of the 2.5D and 3D adoption question on Semiconductor Engineering, an industry content platform that covers the spectrum of semiconductor topics, and occasionally covers 2.5D and 3D, providing the perspective of chip architects, engineers, end users, industry organizations and standards bodies. What I find most interesting in these... »

SEMICON Europa 2012 Focuses on Materials, 3D ICs, and 450mm

SEMICON Europa got underway yesterday, and reports from the event point to new materials, 450mm and 3D ICs as the key topics – all from the European perspective. According to SEMI Europe President, Heinz Kundert, Europe has reached a critical crossroads where its very future as a global competitor seems to hinge on making it in micro- and nano-electronics. "Europe must not risk the walking away ... »