3D VLSI

3D VLSI Open Workshop Showcases 3D IC Supply Chain Capabilities  

3D VLSI Open Workshop Showcases 3D IC Supply Chain Capabilities  

Severine Cheramy, Director 3D Business Development, at CEA-Leti, recently brought key partners of Leti’s 3D-IC programs together at the 6th 3D VLSI Open Workshop to give an overview of their accomplishments and to demonstrate synergies between their joint efforts. The event took place in mid-October at The DoubleTree Hotel in San Jose. Leti and ST Microelectronics: Leaders in 3D VLSI Cheramy wel... »

3D VLSI is the New Active Interposer

3D VLSI is the New Active Interposer

 3D very large system integration (3D VLSI) has many aliases. This high-density approach to 3D system integration first appeared on the scene as monolithic 3D (M3D), or as Leti dubbed it: sequential 3D. In 2014, the French research institute officially introduced it as CoolCube™ because this version of the technology addressed the thermal issues that plagued early versions of M3D. This paved th... »