3D technologies

Bridging the Interconnect Pitch Gap Calls for 3D Technologies

Bridging the Interconnect Pitch Gap Calls for 3D Technologies

Last week at IWLPC, keynote speaker, Doug Yu, TSMC, kicked off the event with a similar storyline used by ASE’s Tien Wu during his IMAPS Symposium keynote earlier this month: High-performance applications like artificial intelligence (AI), 5G, autonomous driving, and even high-end smartphones are driving the continuation of Moore’s Law augmented by More than Moore. This need for high-performan... »

UnitySC Receives Multiple Orders for Wafer Thinning Inspection Systems

UnitySC Receives Multiple Orders for Wafer Thinning Inspection Systems

Grenoble, France, May 9, 2017 – UnitySC, a leader in advanced inspection and metrology solutions, today announced multiple orders from a leading integrated device manufacturer (IDM) for its modular 4See Series automated defect inspection platform. The systems were selected because they deliver optimal wafer backside surface and edge defect inspection, post wafer thinning and metallization. The 4... »

3D InCites’ Guide to Navigating theThird Dimension at SEMICON West

There’s no doubt about it, the 3D technology related workshops, lectures, and presentations happening at and around SEMICON West this year are plentiful and varied. There’s something for everyone: 3D metrology, 3D interconnect and standards development; 3D IC co-design, 3D bonding and thin wafer handling, 3D test solutions, commercialization of TSV and cost of ownership, supply chain conside... »