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Finetech Secures Eurostars Funding to Advance Sub-micron Integration of Dual-color MicroLED Microdisplays
An 18-month Eurostars-3 R&D project will address one of the key bottlenecks in next-generation display manufacturing: the sub-micron integration of...
Akrion Systems Commences Joint Development Programs for 3D Integration Processes with Leading Research Organizations
Allentown, Pa., March 5, 2014 – Akrion Systems recently engaged in two new Joint Development Programs (JDPs) with leading-edge semiconductor research...
Silicon Photonics: the Next Killer App for 3D ICs? and more from the R&D Community
First it was going to be memory stacks, then it was Wide I/O DRAM on Memory, and now, as commercialization...3D Integration Research, SEMATECH Style
SEMATECH’s story is one that is truly built upon the essence of collaboration. SEMATECH is not a traditional research center. ...3D R&D Round-up: Part 1: RTI International
At last month’s 3D Architectures for Semiconductor Integration and Packaging Conference, coordinated by RTI International, three government-funded research institutes...
3D InCites Turns One
Happy Birthday to US! Happy Birthday to US!! Happy BIRTHDAY, 3D InCites….. HAPPY BIRTHDAY TO US!
SEMATECH Technologists Detail Process Advances to Accelerate 3D Manufacturing Readiness
With a focus on providing cost-effective and reliable solutions to speed manufacturing readiness of 3D technology options, experts from SEMATECH’s...Successful 3D Integration takes more than new technologies
In last week’s discussions in the design space — Is TSV a...
Old World to New World in under 5 minutes
I just got back from a stroll from the Begijnhof Congres Hotel to the Grote Markt (Great Market Square)...
CEA-Leti: A visit to the mother ship
If your company is located in France, and/or is involved in micro and nanotechnologies for microelectronics, chances are it’s...