3d pathfinding tools

3D ASIP 2014: All Aboard the 3D IC Train!

3D ASIP 2014: All Aboard the 3D IC Train!

Like the previous 10 years, RTI International held the 11th 3D-IC focused conference in early December. Instead of the usual two and a half days, this year it spanned 3 days, because it also offered a 4-hour session about 3D design challenges and solutions available from foundries, EDA and IP vendors, a power-user’s 3D views, as well as a low-power design tutorial presented by Si2’s Jerry Fren... »

Are there still Gaps in 3D IC Readiness?

Are there still Gaps in 3D IC Readiness?

Good news! At last week’s GSA 3D IC Packaging Working Group Meeting, July 23, 2014, Jan Vardaman uttered the words I’ve been waiting to hear her say for quite some time. “Memory stacks with TSVs are here!” Vardaman cited three companies actively involved in new memory architectures, all of which involve stacking memory either with or without interposers – Tezzaron, Micron and Hynix. She ... »

Path Finding: Who Performs and When?

Path Finding: Who Performs and When?

Microelectronic products all have mechanical, thermal and electrical properties that degrade until the device is permanently damaged. Path finding adds value to an end-product by pre-determining where the breaking points are, and if or how they can be enlarged. For decades, product designers have used various methods of path finding to determine optimum solutions for the design and manufacture of ... »

Are Design Tools and Thermal Solutions the Missing Links to 2.5D and 3D IC Production?

Are Design Tools and Thermal Solutions the Missing Links to 2.5D and 3D IC Production?

On one side of the fence, we have semiconductor device manufacturers (fabs, foundries, and OSATS) claiming to be ready to ramp 2.5D and 3D IC devices to production, saying that remaining issues can be engineered out. On the other side, we have system integrators who, while they believe 2.5D and 3D ICs are the answer to their performance and power prayers, aren’t ready to dive in head first becau... »

EDA Approaches to 3D IC Tools

When I was in high school and then in college, I used my mother’s Smith-Corona  MANUAL typewriter to write all my English and journalism papers. (Yes, electric typewriters already existed, but we were "slow adopters" — aka "cheap" — heck, we didn’t even have a color TV until 1981) Those were the days of white-out, carbon paper, and lots and lots of revisions. Watching my high school-age d... »