3D Memory

With 3D Memory Cubes You Can Finally Break Down the Dreaded Memory Wall

With 3D Memory Cubes You Can Finally Break Down the Dreaded Memory Wall

In July and August schools are closed and many people like to take vacation. Typically nothing major happens during these months. Not this year! It was a lively August, if you consider the recent “adjustments” in the stock markets worldwide as a series of events disrupting the summer doldrums. But I am not here to give you investment advice. So let’s move on to a subject I am more familiar w... »

Indium Corporation: Wafer Flux WS-3543

Indium Corporation: Wafer Flux WS-3543

Indium Corporation’s wafer bumping flux WS-3543 is a low-viscosity semiconductor-grade flux, specifically optimized for uniform solder bump formation across wafers up to 300mm (12 inches) in diameter. WS-3543 washes off completely, even after repeated application, reflow, and cleaning cycles, as may be seen in bump rework and after probe testing. Testimonial Indium Corporation’s wafer bumping ... »

DATE 2015 demonstrates Europe’s commitment to Semiconductors, Part 2

DATE 2015 demonstrates Europe’s commitment to Semiconductors, Part 2

Continuing from Part 1: On Thursday morning I really enjoyed the Monolithic 3D session. Francoise already reported about it, so I can be brief and focus on the most advanced program presented, the CEA Leti CoolCube™ . Olivier Billoint showed and explained how Leti, in cooperation with an EDA partner, is developing the integration of two layers of functions on a wafer. The first layer uses a reg... »

What’s Different for 3D Stacked DRAM Equipment Shipments in 2015?

What’s Different for 3D Stacked DRAM Equipment Shipments in 2015?

Why DID you miss your 2014 3D Stacked DRAM equipment shipment forecast? And what’s different about the outlook for 3D Stacked DRAM equipment shipments in 2015? Briefly, as presented in Part 1 of this thread, significant structural problems existed in the DRAM industry, present from the very beginning of 2012, that impeded the roll-out and adoption of 3D Stacked DRAM as a commercial product. Thr... »

Why You Missed Your 2014 3D Stacked DRAM Equipment Shipment Forecast

Why You Missed Your 2014 3D Stacked DRAM Equipment Shipment Forecast

Remember SEMICON West 2012? How could you forget? It was all clubbing with your customers at The Redwood Room, DNA Lounge, and The Endup after a few standout meals with them at Mission Chinese Food, Slanted Door, Wayfare Tavern, Acquerello, and Absinthe that were preceded by a few drinks with the team at House of Shields, Rickhouse, and The Old Ship Saloon that followed a day on the show floor tha... »

3D ASIP Pre-Conference Symposium brings together Design and Process for 3D ICs

3D ASIP Pre-Conference Symposium brings together Design and Process for 3D ICs

Despite efforts to leverage the one hour time difference from Phoenix to San Francisco to my advantage, I arrived on the scene at the 2014 3D ASIP Conference to find the morning Pre-conference Symposium on (Interposer) and 3D Design Tools and Flows already well underway. My absence did not go un-noticed by the first presenter, Bill Martin, E-System Design, or by the session organizer and fellow 3D... »

Topics of Discussion at GIT 2014

Topics of Discussion at GIT 2014

In my previous post I talked a bit about the ongoing debate that went on during last week’s Global Interposer Technology Workshop (GIT 2014) which took place at Georgia Tech’s Global Learning Center. Do we wait for the “trickle down” effect to take place and bring the cost of interposer and 3D ICs down, or do we create a consortium to focus on developing low-cost interposer solutions?... »

GSA 3D IC Working Group Looks at 3D IC Readiness from Design through Manufacturing

GSA 3D IC Working Group Looks at 3D IC Readiness from Design through Manufacturing

At the recent GSA 3D IC Working Group Meeting (October 22, 2014), where speakers from BroadPak, Amkor, and Invensas presented on 3D IC readiness, I was struck by three observations. First of all, while challenges to 3D commercialization still remain, but they’ve shifted from manufacturing challenges to design and infrastructure challenges. Secondly, high volume manufacturing (HVM) means differen... »

Book Review: Vertical 3D Memory Technologies

Book Review: Vertical 3D Memory Technologies

“From so simple a beginning endless forms most beautiful and most wonderful have been, and are being, evolved.” ~ Charles Darwin Charles Darwin was obviously not thinking of 3D semiconductor memories when he said this but the thought is appropriate. With the recent introduction of the first monolithic 3D Flash memory, the time is ripe to describe how the industry came to this point and what ot... »

2014 VLSI Symposium, Honolulu

3D NAND Flash at the 2014 VLSI Symposium

Imagine this: aquamarine tints of the Pacific washing sandy Hawaiian beaches amid the balmy breeze and only yards away, several 3D NAND papers being presented at the recent VLSI Symposium in Honolulu. Idyllic! I counted five papers in total associated with various forms of 3D NAND. The protagonists were: SK Hynix in association with KAIST on one paper and Seoul National University on another; Macr... »

Page 1 of 212