3D InCites 10th Anniversary

3D Powered: From Image Sensors to Artificial Intelligence

3D Powered: From Image Sensors to Artificial Intelligence

The widespread deployment of 3D stacked CMOS Image Sensors (CIS) in consumer electronics, namely smartphones, by handset makers domestic (Apple, iPhone) and overseas (Samsung, Galaxy), is certain proof that 3D integration technologies pivoted over the last ten years from being something useful only for fairly esoteric applications and high ASP products, to being a technology that reached the right... »

3D InCites Turns 10: A Brief Analysis of the 3D Journey

3D InCites Turns 10: A Brief Analysis of the 3D Journey

I cannot believe 3D InCites is already turning 10! As wise people say, time flies!  Taking a step back, I have to admit a lot of progress has been made since my first attendance as a young engineer to the EMC 3D workshops back in 2008. At that time, we were discussing how to form a via, how to fill it, how to use a temporary wafer carrier to process thin wafers…etc. We are definitely more m... »