3D IC thermal management

Dow Corning: Thermally Conductive Gel TC-3040

Dow Corning: Thermally Conductive Gel TC-3040

TC-3040 is designed for advanced flip chip devices requiring improved heat dissipation.  The material features a combination of low modulus and high elongation – enabling it to accommodate warpage-induced stresses.  Key to the improved thermal performance : low contact resistance that silicones are known for, along with proprietary filler technology. Testimonial While advanced 2.5D or 3D... »

Progress Reports for 3D IC Thermal Management and Test

Progress Reports for 3D IC Thermal Management and Test

In Jan Vardaman’s recent readiness report card issued at 3D ASIP in December, 3D IC thermal management issues scored and “F” for lack of a solution o the hot-spot problem when stacking memory on logic. And while she gave 3D IC test a “B” for probe card development, it got an incomplete for reliability data. At the end of her presentation, she invited anyone with new solutions to “see ... »