3D IC readiness

GSA 3D IC Working Group Looks at 3D IC Readiness from Design through Manufacturing

GSA 3D IC Working Group Looks at 3D IC Readiness from Design through Manufacturing

At the recent GSA 3D IC Working Group Meeting (October 22, 2014), where speakers from BroadPak, Amkor, and Invensas presented on 3D IC readiness, I was struck by three observations. First of all, while challenges to 3D commercialization still remain, but they’ve shifted from manufacturing challenges to design and infrastructure challenges. Secondly, high volume manufacturing (HVM) means differen... »

Are there still Gaps in 3D IC Readiness?

Are there still Gaps in 3D IC Readiness?

Good news! At last week’s GSA 3D IC Packaging Working Group Meeting, July 23, 2014, Jan Vardaman uttered the words I’ve been waiting to hear her say for quite some time. “Memory stacks with TSVs are here!” Vardaman cited three companies actively involved in new memory architectures, all of which involve stacking memory either with or without interposers – Tezzaron, Micron and Hynix. She ... »