3D FPGA

Xilinx: Ultrascale VU440 3D FPGA

Xilinx: Ultrascale VU440 3D FPGA

The Xilinx Ultrascale VU440 3D FPGA is constructed using “Xinterposer” 3D IC technology jointly developed by Xilinx and TSMC. It uses a low-k dielectric chip fabricated on 20nm silicon node with a total of 375,000 micron bumps stacked on 25mm x 45mm silicon interposer and assembled with CoWoS. The composite 3D FPGA consists of approximately 19 billion transistors. Testimonial: The Ultrasca... »

Scaling 100G Wired Applications with Heterogeneous 3D FPGAs

Scaling 100G Wired Applications with Heterogeneous 3D FPGAs

By: Ehab Mohsen, Xilinx To address the insatiable demand for bandwidth, the communications industry is accelerating development of Nx100G line cards for networking systems. In order for equipment manufacturers to scale infrastructure economically and effectively, they must leverage the latest optical interconnect technologies, suh as CFP2 and in the future CFP4, to increase bandwidth while lowerin... »

This Week in 3D IC News (Oct 8-12)

All Programmable PlanetToday All Programmable Planet’s newsletter appeared in my inbox, with a great post by Max Maxfield on the Xilinx family of 3D FPGAs.  Beyond the detailed descriptions of Xilinx’ products, and explanation between the difference between 3D FPGA and 3D Heterogeneous FPGA, I especially like Max’s musings on page two, about the realm of possibilities that could be achieved »

SEMICON Taiwan’s 3D Tech Forum: Were You There?

I didn’t make it to the SEMICON Taiwan SiP Global Summit this year and was hoping to find some coverage by other journalists so that I could at least curate and share the information on the 3D IC Technology Forum. Unfortunately, I didn’t see anything posted on the topic, but Dan Tracy of SEMI was kind enough to share several presentations so I could review and summarize them for 3D InCites. Th... »