3D ASIP 2017

The 14th ASIP Addresses a Spectrum of Advanced Packaging Opportunities, Part 2

The 14th ASIP Addresses a Spectrum of Advanced Packaging Opportunities, Part 2

Part 1 of my 3D ASIP blog covered the five keynotes presented at 3D ASIP 2017. Part 2 focuses on more than 20 informative presentations, where focused experts gave an in-depth view of new and/or improved technologies for 3DIC-related advanced packaging. Before we address these, allow me a one-sentence recap of Part 1’s key message: We no longer have one major application, like mainframes, PCs, a... »