3D ASIP 2015

‘Tis the Season for the 3D ASIP Multi-Die IC Design Tutorial

‘Tis the Season for the 3D ASIP Multi-Die IC Design Tutorial

While the shopping malls and specialty stores in and around San Francisco were packed with people hunting for Holiday presents, a very dedicated crowd of 3D IC developers and users from all over the world got together near San Francisco, for the 12th 3D ASIP conference, which featured, once again, the multi-die IC Design Tutorial. Conference presenters reviewed the progress made in 2015 and discus... »

IC and System Designers, This Could be the Best Four Hours Spent this Year

IC and System Designers, This Could be the Best Four Hours Spent this Year

Don’t miss a full morning of expert presentations about 3D-IC and Interposer design tools and methodologies! Since 2004, every December RTI International has organized  a 3D technology focused conference in Burlingame, near the San Francisco Airport. Supply side industry experts presented the progress they had made in developing new manufacturing and metrology equipment, advancements in materi... »