2015 3D InCites Awards

Congratulations to the Winners of the 2015 3D InCites Awards

Congratulations to the Winners of the 2015 3D InCites Awards

For the third consecutive year, 3D integration enthusiasts gathered at the Impress Lounge at SEMICON West for the 2015 3D InCites Awards Breakfast, sponsored by Micron, to celebrate innovation in 3D integration and honor those who have contributed significantly to the advancement of innovative processes that enable interposer integration, 3D ICs, monolithic 3D, 3D memory, and 3D heterogeneous inte... »

Lam Research: SABRE 3D

Lam Research: SABRE 3D

SABRE® 3D is a next-generation electroplating product designed to meet leading-edge production requirements for advanced packaging applications.  This product leverages proprietary front-end manufacturing technology and offers market-specific solutions for copper pillar and through-silicon via (TSV) fabrication.  SABRE 3D offers industry-leading throughput along with reduced cost of consumabl... »

Nordson ASYMTEK: Programmable Tilt + Rotate 5-Axis Fluid Dispenser

Nordson ASYMTEK: Programmable Tilt + Rotate 5-Axis Fluid Dispenser

Nordson ASYMTEK’s programmable Tilt + Rotate 5-Axis Fluid Dispenser dispenses using 5 axes instead of 3. The X and Y tilt enables dispensing from a vertical position, varying tilt angles to all sides of a component and up to the top of a 3D stacked die with high precision and positional accuracy. Testimonial Jet dispensing of capillary underfill fluid is a standard process for producing semicond... »

Mentor Graphics: Xpedition Package Integrator

Mentor Graphics: Xpedition Package Integrator

Xpedition® Package Integrator provides a holistic co-design methodology that automates planning and optimization of connectivity from a chip through multiple packaging variables, while targeting multiple PCB platforms. Engineers can quickly and easily assemble complete cross-domain systems (IC, package & board) and drive ball map plans and pin optimization through a rule-based methodology. Te... »

Dow Corning: Thermally Conductive Gel TC-3040

Dow Corning: Thermally Conductive Gel TC-3040

TC-3040 is designed for advanced flip chip devices requiring improved heat dissipation.  The material features a combination of low modulus and high elongation – enabling it to accommodate warpage-induced stresses.  Key to the improved thermal performance : low contact resistance that silicones are known for, along with proprietary filler technology. Testimonial While advanced 2.5D or 3D... »

SPTS: Sigma fxP PVD with Multi-Wafer Degas

SPTS: Sigma fxP PVD with Multi-Wafer Degas

SPTS’s Sigma® fxP, is a well established PVD system used in advanced packaging applications such as UBM and RDL. It utilizes batch degas technology that can improve Rc whilst maintaining high throughputs, despite the outgassing challenges posed from the increasing use of organics, such as mold in Fan-Out WLP. Testimonial Fan-Out Wafer Level Packaging (FOWLP) technology is an increasingly popula... »

Broadpak: 2.5D/3D Package Security IP

Broadpak: 2.5D/3D Package Security IP

Industry’s first 2.5D/3D security IP from BroadPak provides trusted security and resilience needed for critical 2.5D/3D system integration and prevents hijacking of critical data. This new technology is shifting the paradigm in semiconductor industry and enables chip makers and system companies to develop new generations of secure products. This breakthrough technology prevents reverse engineeri... »

Dow Electronic Materials: SOLDERON™ BP TS 6000 Tin-Silver Chemistry

Dow Electronic Materials: SOLDERON™ BP TS 6000 Tin-Silver Chemistry

SOLDERON™ BP TS 6000 Tin-Silver is a lead-free chemistry for solder bump applications. From a single formulation, it is capable of plating speeds of 2-9+ µm/min, tunable composition and the industry’s most robust process window. This flexibility makes it ideal for applications from C4 bumping to micro-Cu pillar capping. Testimonial In the latest 2.5D and 3D packaging schemes utilizing copper ... »

KLA-Tencor: CIRCL-AP™

KLA-Tencor: CIRCL-AP™

CIRCL-AP™ is a cluster tool with multiple modules, covering all-surface inspection, metrology and review at high throughput for efficient advanced wafer level packaging (AWLP) process control. The CIRCL-AP provides production-proven, high sensitivity monitoring capability for multiple AWLP applications including 2.5D/3D integration, wafer-level chip scale packaging and fan-out wafer-level packag... »

Indium Corporation: Wafer Flux WS-3543

Indium Corporation: Wafer Flux WS-3543

Indium Corporation’s wafer bumping flux WS-3543 is a low-viscosity semiconductor-grade flux, specifically optimized for uniform solder bump formation across wafers up to 300mm (12 inches) in diameter. WS-3543 washes off completely, even after repeated application, reflow, and cleaning cycles, as may be seen in bump rework and after probe testing. Testimonial Indium Corporation’s wafer bumping ... »

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