2.5D/3D security

EMIB, the 3D Technology Landscape, and other Keynote Moments from IMAPS DPC 2016

EMIB, the 3D Technology Landscape, and other Keynote Moments from IMAPS DPC 2016

This year’s keynote talks at the 2016 IMAPS Device Packaging Conference (DPC 2016) provided some new insight into a number of interesting areas of importance to the advanced packaging community. I already addressed Bill Chen’s talk, which focused on system-in-package (SiP) and introduced a 3D Fan-out SiP approach. Here, I’ll focus on the key take-aways from the other three keynote talks that... »

Broadpak: 2.5D/3D Package Security IP

Broadpak: 2.5D/3D Package Security IP

Industry’s first 2.5D/3D security IP from BroadPak provides trusted security and resilience needed for critical 2.5D/3D system integration and prevents hijacking of critical data. This new technology is shifting the paradigm in semiconductor industry and enables chip makers and system companies to develop new generations of secure products. This breakthrough technology prevents reverse engineeri... »